Detailed Product Description
Model: 1) Lead-free solder wire and bar 2) Ordinary solder wire 3) Solder paste Specifications: 1) We produces Lead-free solder wire and bar including Sn/Cu,Sn/Ag,Sn/Sb,Sn/Ag/Cu, Sn/Ag/Bi alloys. 2) We supplied various specifications of solder tin wire,different tin content and wire diameter from 0.3mm to 9.0mm. 3) Solder tin paste is the most important joint material for modern printing wring board and surface makeup technique(SMT).It is determinative factor for ideal and steady soldering effect that chooses appropriate tin paste.Its alloy composition and content and flux type should be concerned. Variety: No-clean solder wire Solid-cored solder wire Dim solder wire High-temperature solder wire Low-temperature solder wire Nickel-plated solder wire Water-soluble solder wire Flux-cored solder wire Solder wire for lamp holder Soldering tin wire special for capacitor Supply kinds of specifications and varieties of tin alloy contents for users
View